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3 notice for taiyo yuden products y please read this notice before using the taiyo yuden products. ? pt ???] ?; w m tx ? pt
a ? t b?s ? ? ? ? cs ? ?xi^m { ? please read the "notice for taiyo yuden products" before using this catalog. 1 information on the general catalog reminders product information in this catalog is as of october 2008 . all of the contents specified herein are subject to change without notice due to technical improvements, etc. therefore, please check for the latest information carefully before practical application or usage of the products. please note that taiyo yuden co., ltd. shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those speci?ed in this catalog or individual speci?cation. please contact taiyo yuden co., ltd. for further details of product specifications as the individual speci?cation is available. please conduct validation and veri?cation of products in actual condition of mounting and operating environment before commercial shipment of the equipment. all electronic components or functional modules listed in this catalog are developed, designed and intended for use in general electronics equipment.(for av, of?ce automation, household, of?ce supply, information service, telecommunications, (such as mobile phone or pc) etc.). before incorporating the components or devices into any equipment in the ?eld such as transportation,( automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have direct in?uence to harm or injure a human body, please contact taiyo yuden co., ltd. for more detail in advance. do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, submarine system, military, etc. where higher safety and reliability are especially required. in addition, even electronic components or functional modules that are used for the general electronic equipment, if the equipment or the electric circuit require high safety or reliability function or performances, a suf?cient reliability evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to install a protective circuit is strongly recommended at customer's design stage. the contents of this catalog are applicable to the products which are purchased from our sales of?ces or distributors (so called ? taiyo yuden ? s of?cial sales channel ? ). it is only applicable to the products purchased from any of taiyo yuden ? s of?cial sales channel. please note that taiyo yuden co., ltd. shall have no responsibility for any controversies or disputes that may occur in connection with a third party's intellectual property rights and other related rights arising from your usage of products in this catalog. taiyo yuden co., ltd. grants no license for such rights. caution for export certain items in this catalog may require specific procedures for export according to ? foreign exchange and foreign trade control law ? of japan, ? u.s. export administration regulations ? , and other applicable regulations. should you have any question or inquiry on this matter, please contact our sales staff. should you have any question or inquiry on this matter, please contact our sales staff.
192 ? pt ???] ?; w m tx ? pt
a ? t b?s ? ? ? ? cs ? ?xi^m { ? please read the "notice for taiyo yuden products" before using this catalog. c k 2 1 2 5 1 r 0 m _ t 6 5 4 3 2 1 goyordering code ;my applications ??y features standard products m ?20 1608 0603 1.60.8 2125 0805 y2.01.25 ? 1r0 1 100 10 a j ? m ?20 1608 0603 1.60.8 2125 0805 2.01.25 ck
u
??????? ~ > 3?????wh? z ????w c
\ usx z ?s?
t 7& ~
?t?3???wh?z?m ?t
q??q ~ internal printed coil structure creates a closed magnetic circuit which acts as a magnetic shield eliminating crosstalk, thus permitting higher mounting densities. ~ multilayer block structure yields higher r eliability . ~ separation of analog and digital cuircuits. ~ prevents interference between pll and the other digital circuits.
u
??????? multilayer chip inductors ck series ~ ??? s? q??? s? w m { ~ pll s? qfw ??? s? w ? ?w- { 1 operating temp. ?40?85? ? ? ?????? h 4 ?????? ?0) ? 6 ptgg? 3 ck multilayer chip inductors 1 type nominal inductance h 4 inductance tolerances % 6 internal code 3 5 a
?t ???a?e?? 2 y
go lw mm 2 exter nal dimensions lw mm 5 packaging ? t tape & reel 1?? =blank space tr1 ?
:: example 1r0 1 100 10 *r=decimal point
ferrite products 5 193 ? pt ???] ?; w m tx ? pt
a ? t b?s ? ? ? ? cs ? ?xi^m { ? please read the "notice for taiyo yuden products" before using this catalog. ?
goyexternal dimensions ?t??3??y available inductance range p. 194 p. 195 p. 244 p. 246 p. 254 ?3???? selection guide p. 14 unitmm inch ??aa part numbers ?
q
$ electrical characteristics a packaging ?t
q reliability data ?; w ?? pr ecautions etc type ck1608 imax ck2125 imax range |ma [ma] 0.10 r10m 500 0.15 r15m 500 0.22 r22m 400 0.33 r33m 400 0.47 r47m 400 0.68 r68m 300 1.00 1 r 0 m 220 1.50 1 r 5 m 170 2.20 2 r 2 m 150 3.30 3 r 3 m 130 4.70 4 r 7 m 60 4r7m 120 6.80 6 r 8 m 70 10.00 100 m 50 100 m 60 type l w t e ck 1608 1.6?0.15 0.8?0.15 0.8?0.15 0.3?0.2 0603 0.063?0.006 0.031?0.006 0.031?0.006 0.012?0.008 2.00.3 0.85?0.2 ck 2125 ?0.1 1.25?0.2 1.25?0.2 0.5?0.3 0805 0.079 0.012 0.049?0.008 0.033?0.008 0.020?0.012 ?0.004 0.049?0.008 inductance |h
194 ? pt ???] ?; w m tx ? pt
a ? t b?s ? ? ? ? cs ? ?xi^m { ? please read the "notice for taiyo yuden products" before using this catalog. ??aay part numbers rohs 4.7 20 25 0.45 60 4 rohs 10.0 20 17 0.85 50 2 ? ? ?????? inductance h ?????? ?0) inductance tolerance ~? *t
: self resonant frequency |mhz min. v ? dc resistance
?30 % ?v rate current ma max. *t
: measuring frequency mhz ^ thickness mm inch yy ordering code & min. ck1608 0.8?0.15 0.031?0.006 ?20? c k 1 6 0 8 4 r 7 m c k 1 6 0 8 1 0 0 m rohs 0.10 15 235 0.16 500 25 rohs 0.15 15 200 0.20 500 25 rohs 0.22 15 170 0.23 400 25 rohs 0.33 15 145 0.28 400 25 rohs 0.47 15 125 0.32 400 25 rohs 0.68 15 105 0.45 300 25 rohs 1.0 20 75 0.26 220 10 rohs 1.5 20 60 0.28 170 10 rohs 2.2 20 50 0.35 150 10 rohs 3.3 20 41 0.43 130 10 rohs 4.7 20 35 0.48 120 10 rohs 6.8 20 29 0.52 70 4 rohs 10.0 20 24 0.65 60 2 ? ? ?????? inductance h ?????? ?0) inductance tolerance ~? *t
: self resonant frequency |mhz min. v ? dc resistance
max. ?v rate current ma max. *t
: measuring frequency mhz ^ thickness mm inch yy ordering code & min. ck2125 ?20? c k 2 1 2 5 r 1 0 m c k 2 1 2 5 r 1 5 m c k 2 1 2 5 r 2 2 m c k 2 1 2 5 r 3 3 m c k 2 1 2 5 r 4 7 m c k 2 1 2 5 r 6 8 m c k 2 1 2 5 1 r 0 m c k 2 1 2 5 1 r 5 m c k 2 1 2 5 2 r 2 m c k 2 1 2 5 3 r 3 m c k 2 1 2 5 4 r 7 m c k 2 1 2 5 6 r 8 m c k 2 1 2 5 1 0 0 m ehs (environmental hazardous substances) ehs (environmental hazardous substances) 0.85 ? 0.2 0.033 ? 0.008 1.25 ? 0.2 0.049 ? 0.008 0.85 ? 0.2 0.033 ? 0.008 1.25 ? 0.2 0.049 ? 0.008
ferrite products 5 195 ? pt ???] ?; w m tx ? pt
a ? t b?s ? ? ? ? cs ? ?xi^m { ? please read the "notice for taiyo yuden products" before using this catalog. ?
q
$yelectrical characteristics v o t?
q?ydc bias characteristics ??e??? *t
:?
q?y z vs frequency characteristics ck1608 ck1608
ay packaging 244 ? pt ???] ?; w m tx ? pt
a ? t b?s ? ? ? ? cs ? ?xi^m { ? please read the "notice for taiyo yuden products" before using this catalog. ?a?e??py taping material ?7 ? !?o?
: minimum quantity a?e??ay tape & reel packaging yy type
a ?? thickness | mm inch a j
:? |pcs standard quantity a? paper tape ?? a? embossed tape ck 1608 0603 0 . 8 4000 ? 0 . 03 1 ck 2125 0805 0 . 85 4000 ? 0 . 03 3 1 . 25 ? 200 0 0 . 049 ckp 2520 1008 0 . 9 ? 300 0 0 . 035 1 . 1 ? 200 0 0 . 043 lk 1005 0402 0 . 5 10000 ? 0 . 02 0 lk 1608 0603 0 . 8 4000 ? 0 . 03 1 lk 2125 0805 0 . 85 4000 ? 0 . 03 3 1 . 25 ? 200 0 0 . 049 hk 0603 0201 0 . 3 15000 ? 0 . 01 2 hk 1005 0402 0 . 5 10000 ? 0 . 02 0 hk 1608 0603 0 . 8 4000 ? 0 . 03 1 hk 2125 0805 0 . 85 ? 400 0 0 . 033 1 . 0 ? 300 0 0 . 039 hkq 0603 s 0201 0 . 3 15000 ? 0 . 01 2 aq 105 0402 0 . 5 10000 ? 0 . 02 0 bk 0603 0201 0 . 3 15000 ? 0 . 01 2 bk 1005 0402 0 . 5 10000 ? 0 . 02 0 bk 1608 0603 0 . 8 4000 ? 0 . 03 1 bk 2125 0805 0 . 85 4000 ? 0 . 03 3 1 . 25 ? 200 0 0 . 049 bk 2010 0804 0 . 45 4000 ? 0 . 01 8 bk 3216 1206 0 . 8 ? 400 0 0 . 031 bkp 0603 0201 0 . 3 15000 ? 0 . 01 2 bkp 1005 0402 0 . 5 10000 ? 0 . 02 0 bkp 1608 0603 0 . 8 4000 ? 0 . 03 1 bkp 2125 0805 0 . 85 4000 ? 0 . 03 3 c k 1 6 0 8 c k 2 1 2 5 l k 1 0 0 5 l k 1 6 0 8 l k 2 1 2 5 h k 0 6 0 3 h k 1 0 0 5 h k 1 6 0 8 h k q 0 6 0 3 a q 1 0 5 b k 0 6 0 3 b k 1 0 0 5 b k 1 6 0 8 b k 2 1 2 5 b k 2 0 1 0 b k p 0 6 0 3 b k p 1 0 0 5 b k p 1 6 0 8 b k p 2 1 2 5 2 1 2 5 2 5 2 0 2 1 2 5 2 1 2 5 2 1 2 5 3 2 1 6 c k c k p l k h k b k b k
ay packaging ferrite products 5 245 ? pt ???] ?; w m tx ? pt
a ? t b?s ? ? ? ? cs ? ?xi^m { ? please read the "notice for taiyo yuden products" before using this catalog. ~ a? 8mm ? ????? ? ~ ? leader and blank portion ????
go reel size ?a?e??
goy taping dimensions paper tape 0.315 inches wide 2.0 ? 0.5 0.079 ? 0.031 13.0 ? 0.2 0.512 ? 0.020 ???a?sy top tape strength ??a?w #m?xz<
$1m2to0.1?0.7nqs??b{ the top tape requires a peel-off force of 0.1?0.7 n in the direction of the arrow as illustrated below. unit : mm inch unit : mm inch 160mm? 6.3inches or more ?v z`m2 direction of tape feed 100mm? 3.94inches or more 400mm? 15.7inches or more ~??a?8mm ? embossed tape 0.312 inches wide yy typ e
a ? ? thickness mm in ch ??
? ? chi p cavity
? e?? ins ertion pitch a? ? tape thickness a b f t ck 16 08 0603 0 . 8 0 . 03 1 1 . 0 ? 0 . 2 0 . 03 9 ? 0 . 008 1 . 8 ? 0 . 2 0 . 07 1 ? 0 . 008 4 . 0 ? 0 . 1 0 . 15 7 ? 0 . 004 1 . 1 <0g 0 . 04 3 max ck 2125 0805 0 . 85 0 . 03 3 1 . 5 ? 0 . 2 0 . 05 9 ? 0 . 008 2 . 3 ? 0 . 2 0 . 09 1 ? 0 . 008 4 . 0 ? 0 . 1 0 . 157 ? 0 . 0 04 1 . 1 <0g 0 . 04 3 max lk 1005 0402 0 . 5 0 . 02 0 0 . 65 ? 0 . 1 0 . 02 6 ? 0 . 004 1 . 15 ? 0 . 1 0 . 04 5 ? 0 . 004 2 . 0 ? 0 . 05 0 . 07 9 ? 0 . 002 0 . 8 <0g 0 . 03 1 max lk 1608 0603 0 . 8 0 . 03 1 1 . 0 ? 0 . 2 0 . 03 9 ? 0 . 008 1 . 8 ? 0 . 2 0 . 07 1 ? 0 . 008 4 . 0 ? 0 . 1 0 . 15 7 ? 0 . 004 1 . 1 <0g 0 . 04 3 max lk 2125 0805 0 . 85 0 . 03 3 1 . 5 ? 0 . 2 0 . 05 9 ? 0 . 008 2 . 3 ? 0 . 2 0 . 09 1 ? 0 . 008 4 . 0 ? 0 . 1 0 . 15 7 ? 0 . 004 1 . 1 <0g 0 . 04 3 max hk 0603 0201 0 . 3 0 . 01 2 0 . 40 ? 0 . 06 0 . 01 6 ? 0 . 002 0 . 70 ? 0 . 06 0 . 02 8 ? 0 . 002 2 . 0 ? 0 . 05 0 . 07 9 ? 0 . 002 0 . 45 <0g 0 . 01 8 max hk 1005 0402 0 . 5 0 . 02 0 0 . 65 ? 0 . 1 0 . 02 6 ? 0 . 004 1 . 15 ? 0 . 1 0 . 04 5 ? 0 . 004 2 . 0 ? 0 . 05 0 . 07 9 ? 0 . 002 0 . 8 <0g 0 . 03 1 max hk 1608 0603 0 . 8 0 . 03 1 1 . 0 ? 0 . 2 0 . 03 9 ? 0 . 008 1 . 8 ? 0 . 2 0 . 07 1 ? 0 . 008 4 . 0 ? 0 . 1 0 . 15 7 ? 0 . 004 1 . 1 <0g 0 . 04 3 max hkq 0603 s 0201 0 . 3 0 . 01 2 0 . 40 ? 0 . 06 0 . 01 6 ? 0 . 002 0 . 70 ? 0 . 06 0 . 02 8 ? 0 . 002 2 . 0 ? 0 . 05 0 . 07 9 ? 0 . 002 0 . 45 <0g 0 . 01 8 max aq 105 0402 0 . 5 0 . 02 0 0 . 75 ? 0 . 1 0 . 03 0 ? 0 . 004 1 . 15 ? 0 . 1 0 . 04 5 ? 0 . 004 2 . 0 ? 0 . 05 0 . 07 9 ? 0 . 002 0 . 8 <0g 0 . 03 1 max bk 0603 0201 0 . 3 0 . 01 2 0 . 40 ? 0 . 06 0 . 01 6 ? 0 . 002 0 . 70 ? 0 . 06 0 . 02 8 ? 0 . 002 2 . 0 ? 0 . 05 0 . 07 9 ? 0 . 002 0 . 45 <0g 0 . 01 8 max bk 1005 0402 0 . 5 0 . 02 0 0 . 65 ? 0 . 1 0 . 02 6 ? 0 . 004 1 . 15 ? 0 . 1 0 . 04 5 ? 0 . 004 2 . 0 ? 0 . 05 0 . 07 9 ? 0 . 002 0 . 8 <0g 0 . 03 1 max bk 1608 0603 0 . 8 0 . 03 1 1 . 0 ? 0 . 2 0 . 03 9 ? 0 . 008 1 . 8 ? 0 . 2 0 . 07 1 ? 0 . 008 4 . 0 ? 0 . 1 0 . 15 7 ? 0 . 004 1 . 1 <0g 0 . 04 3 max bk 2125 0805 0 . 85 0 . 03 3 1 . 5 ? 0 . 2 0 . 05 9 ? 0 . 008 2 . 3 ? 0 . 2 0 . 09 1 ? 0 . 008 4 . 0 ? 0 . 1 0 . 15 7 ? 0 . 004 1 . 1 <0g 0 . 04 3 max bk 2010 0804 0 . 45 0 . 01 8 1 . 2 ? 0 . 1 0 . 04 7 ? 0 . 004 2 . 17 ? 0 . 1 0 . 08 5 ? 0 . 004 4 . 0 ? 0 . 1 0 . 15 7 ? 0 . 004 0 . 8 <0g 0 . 03 1 max bkp 0603 0201 0 . 3 0 . 01 2 0 . 40 ? 0 . 06 0 . 01 6 ? 0 . 002 0 . 70 ? 0 . 06 0 . 02 8 ? 0 . 002 2 . 0 ? 0 . 05 0 . 07 9 ? 0 . 002 0 . 45 <0g 0 . 01 8 max bkp 1005 0402 0 . 5 0 . 02 0 0 . 65 ? 0 . 1 0 . 02 6 ? 0 . 004 1 . 15 ? 0 . 1 0 . 04 5 ? 0 . 004 2 . 0 ? 0 . 05 0 . 07 9 ? 0 . 002 0 . 8 <0g 0 . 03 1 max bkp 1608 0603 0 . 8 0 . 03 1 1 . 0 ? 0 . 2 0 . 03 9 ? 0 . 008 1 . 8 ? 0 . 2 0 . 07 1 ? 0 . 008 4 . 0 ? 0 . 1 0 . 15 7 ? 0 . 004 1 . 1 <0g 0 . 04 3 max bkp 2125 0805 0 . 85 0 . 03 3 1 . 5 ? 0 . 2 0 . 05 9 ? 0 . 008 2 . 3 ? 0 . 2 0 . 09 1 ? 0 . 008 4 . 0 ? 0 . 1 0 . 15 7 ? 0 . 004 1 . 1 <0g 0 . 04 3 max yy typ e
a ? ? thi ckness mm 8= 27 ??
? ? chi p cavity
? e?? ins ertion pitch a? ? tap e thickness a b f k t ck 2125 0805 1 . 25 0 . 04 9 1 . 5 ? 0 . 2 0 . 05 9 ? 0 . 008 2 . 3 ? 0 . 2 0 . 09 1 ? 0 . 008 4 . 0 ? 0 . 1 0 . 15 7 ? 0 . 004 2 . 0 0 . 07 9 0 . 3 0 . 01 2 ckp 2520 1008 0 . 9 0 . 03 5 2 . 3 ? 0 . 1 0 . 09 1 ? 0 . 004 2 . 8 ? 0 . 1 0 . 11 0 ? 0 . 004 4 . 0 ? 0 . 1 0 . 15 7 ? 0 . 004 1 . 4 0 . 05 5 0 . 3 0 . 01 2 1 . 1 0 . 04 3 1 . 7 0 . 06 7 lk 2125 0805 1 . 25 0 . 04 9 1 . 5 ? 0 . 2 0 . 05 9 ? 0 . 008 2 . 3 ? 0 . 2 0 . 09 1 ? 0 . 008 4 . 0 ? 0 . 1 0 . 15 7 ? 0 . 004 2 . 0 0 . 07 9 0 . 3 0 . 01 2 hk 2125 0805 0 . 85 0 . 03 3 1 . 5 ? 0 . 2 0 . 05 9 ? 0 . 008 2 . 3 ? 0 . 2 0 . 09 1 ? 0 . 008 4 . 0 ? 0 . 1 0 . 15 7 ? 0 . 004 1 . 5 0 . 05 9 0 . 3 0 . 01 2 1 . 0 0 . 03 9 2 . 0 0 . 07 9 bk 2125 0805 1 . 25 0 . 04 9 1 . 5 ? 0 . 2 0 . 05 9 ? 0 . 008 2 . 3 ? 0 . 2 0 . 09 1 ? 0 . 008 4 . 0 ? 0 . 1 0 . 15 7 ? 0 . 004 2 . 0 0 . 07 9 0 . 3 0 . 01 2 bk 3216 1206 0 . 8 0 . 03 1 1 . 9 ? 0 . 1 0 . 07 5 ? 0 . 004 3 . 5 ? 0 . 1 0 . 13 8 ? 0 . 004 4 . 0 ? 0 . 1 0 . 15 7 ? 0 . 004 1 . 4 0 . 05 5 0 . 3 0 . 01 2
ferrite products 5 247 ? pt ???] ?; w m tx ? pt
a ? t b?s ? ? ? ? cs ? ?xi^m { ? please read the "notice for taiyo yuden products" before using this catalog. reliability data 1/4 multilayer chip inductors and beads * de?nition of rated current : in the ck and bk series, the rated current is the value of current at which the temperature of the element is increased within 20? . in the bk series p type and ck series p type, the rated current is the value of current at which the temperature of the element is increased within 40? . in the lk,hk,hkq,and aq series, the rated current is either the dc value at which the internal l value is decreased within 5 % with the application of dc bias, or the value of current at which the temperature of the element is increased within 20? . item speci?ed value test methods and remarks bk 0603 bk 1005 bk 1608 bk 2125 array bkp 0603 bkp 1005 bkp 1608 bkp 2125 ck 1608 ck 2125 ckp 2520 lk 1005 lk 1608 lk 2125 hk 0603 hk 1005 hk 1608 hk 2125 hkq 0603 s aq 105 bk 2010 bk 3216 . operating temperature ra nge 5 5 ? 1 25 ? 55 ? 85 ? 40 ? 85 ? 55 ? 125 ? 40 ? 85 ? 55 ? 125 ? 2 . storage temperature ra nge 5 5 ? 1 25 ? 55 ? 85 ? 40 ? 85 ? 55 ? 125 ? 40 ? 85 ? 55 ? 125 ? . rated current 100 ? 500 ma 150 ? 1000 ma 150 ? 1500 ma 200 ? 1200 ma 100 ma 100 ? 200 ma 1 . 0 a 1 . 0 a 1 . 0 ? 3 . 0 a 2 . 0 ? 4 . 0 a 5 0 ? 6 0 ma dc 60 ? 500 ma dc 1 . 1 ? 1 . 4 dc 1 0 ? 2 5 ma dc 1 ? 50 m a dc 5 ? 300 ma dc 60 ? 470 ma dc 110 ? 300 ma dc 150 ? 300 ma dc 300 ma dc 130 ? 600 ma dc 280 ? 710 ma dc . impedance 10 ? 6 00
? 25 % 10 ? 1000
? 25 % 22 ? 2500
? 25 % 15 ? 2500
? 25 % 5 ? 600
? 25 % 68 ? 1000
? 25 % 22 ? 33
? 25 % 120
? 25 % 33 ? 390
? 25 % 33 ? 220
? 25 % ?? ?? ?? ?? ?? ?? ?? ?? ?? ?? ?? ?? bk 0603 series bkp 0 603 y series me a suring frequency 100 ? 1 mhz me a suring equipment hp 4291 a me a suring jig 16193 a bk 1 0 05 series bk p 1 005 series me a suring frequency 100 ? 1 mhz me a suring equipment hp 4291 a me a suring jig 16192 a, 16193 a bk 1 6 08 , 2125 series bk p 1 608 , 2125 series me a suring frequency 100 ? 1 mhz me a suring equipment hp 4291 a, hp 4195 a me a suring jig 16092 a or 16192 a hw bk 2 0 10 , 3216 series me a suring frequency 100 ? 1 mhz me a suring equipment hp 4291 a, hp 4195 a me a suring jig 16192 a . impedance ?? 4 . 7 ? 10 . 0 h ? 20 % 0 . 1 ? 10 . 0 h ? 20 % 1 . 0 ? 4 . 7 h ? 20 % 0 . 12 ? 2 . 2 h ? 10 % q 0 . 12 ? 2 . 2 h ? 30 % 0 . 047 ? 33 . 0 h ? 20 % 0 . 10 ? 12 . 0 h ? 10 % q 0 . 12 ? 2 . 2 h ? 30 % 0 . 04 7 ? 33 . 0 h ? 2 0 % 0 . 10 ? 12 . 0 h ? 10 % q 0 . 12 ? 2 . 2 h ? 30 % 1 . 0 ? 6 . 2 nh ? 0 . 3 nh 6 . 8 ? 100 nh ? 5 % 1 . 0 ? 6 . 2 nh ? 0 . 3 nh 6 . 8 ? 270 nh ? 5% 1 . 0 ? 5 . 6 nh ? 0 . 3 nh 6 . 8 ? 470 nh ? 5% 1 . 0 ? 5 . 6 nh ? 0 . 3 nh 6 . 8 ? 470 nh ? 5% 0 . 6 ? 6 . 2 nh ? 0 . 3 nh 6 . 8 ? 22 nh ? 5% 1 . 0 ? 6 . 2 nh ? 0 . 3 nh 6 . 8 ? 15 nh ? 5% ck series mea suring frequency 2 to 4 mhz ck 1608 me a suring frequency 2 to 25 mhz ck 2125 me a suring frequency 1 mhz ckp 2520 lk s e ries me a suring frequency 10 to 25 mhz lk 1005 me a suring frequency 1 to 50 mhz lk 1608 me a suring frequency 0 . 4 to 50 mhz lk 2125 me a suring equipment, jig hp 4 1 94 + 16085 b + 16092 a or its equivalent hp 4 1 95 + 41951 + 16092 a or its equivalent hp 4 2 94 + 16192 a hp 4 2 91 a+ 16193 a lk 1005 hp 4 2 85 a+ 42841 a+ 42842 c+ 42851 61100 ckp 2520 me a suring current 1 ma r m s 0 . 047 to 4 . 7 h 0 . 1 ma r m s 5 . 6 to 33 h hk , a q series measuring frequency 100 mhz hk 0603 ~ hk 1 005 ~ a q 105 yyyy mea suring frequency 50 / 100 mhz hk 1608 ~ hk 2 125 y mea suring frequency 500 mhz hkq 0603 s measuring equipment, jig hp 4291 a + 16197 a hk 0603 ~ aq 1 05 hp 42 91 a + 16193 a hk 1005 e 49 9 1 a + 16197 a hkq 0603 s hp 4291 a or its equivalent + 16092 a + in-house made jig hk 1608 , 2125 y y yy
ferrite products 5 249 ? pt ???] ?; w m tx ? pt
a ? t b?s ? ? ? ? cs ? ?xi^m { ? please read the "notice for taiyo yuden products" before using this catalog. reliability data 2/4 multilayer chip inductors and beads item speci?ed value test methods and remarks bk 0603 bk 1005 bk 1608 bk 2125 array bkp 0603 bkp 1005 bkp 1608 bkp 2125 ck 1608 ck 2125 ckp 2520 lk 1005 lk 1608 lk 2125 hk 0603 hk 1005 hk 1608 hk 2125 hkq 0603 s aq 105 bk 2010 bk 3216 6 }q ?? 20 min. 15 ? 20 min. ?? 10 ? 20 min. 10 ? 35 min. 15 ? 50 min. 4 ? 5 min. 8 mi n . 8 ? 12 min. 10 ? 18 min. 10 ? 13 min. 8 mi n . ck series mea suring frequency 2 t o 4 m hz ck 1608 mea suring frequency 2 t o 25 m hz ck 2125 lk series me a suring frequency 10 to 25 m h z lk 1005 mea suring frequency 1 t o 50 m hz lk 1608 mea suring frequency 0 . 4 t o 50 m hz lk 2125 mea suring equipment, jig hp 4194 16085 b 16092 a or its equivalent ~ hp 4 195 a 4 1951 16092 a or its equivalent ~ hp 4 294 a 1 6192 a ~ hp 4 291 a 1 6193 a lk 1005 mea suring current ~ 1 ma rms 0 . 047 to 4 . 7 h ~ 0 . 1 ma r ms 5 . 6 t o 33 h hk , h kq, aq series me a suring frequency 10 0 m h i hk 0603 ~ hk 1 005 ~ a q 105 measuring frequency 50 / 100 m hz hk 1608 ~ hk 2125 measuring frequency 500 m hz h kq 0603 s mea suring equipment, jig ~ hp 4 291 a 1 6197 a hk 0603 ~ aq 105 ~ hp 4 291 a 1 6193 a hk 1005 ~ e 4991 a 16197 a hkq 0603 s ~ hp 4294 a 16092 a in-house made jig hk 1608 ~ hk 2125 7 } dc resistance 0 . 07 ? 1 . 50
ma x . 0 . 05 ? 0 . 80
max . 0 . 05 ? 1 . 10
max . 0 . 05 ? 0 . 75
ma x . 0 . 10 ? 0 . 90
max . 0 . 15 ? 0 . 80
max . 0 . 065 ? 0 . 070
max . 0 . 140
ma x . 0 . 025 ? 0 . 140
ma x . 0 . 020 ? 0 . 050
max . 0 . 45 ? 0 . 85
? 30 % 0 . 16 ? 0 . 65
max. 0 . 08 ? 0 . 15 ma x . 0 . 7 ? 1 . 70
max . 0 . 2 ? 2 . 2
max . 0 . 1 ? 1 . 1
max . 0 . 11 ? 3 . 74
max . 0 . 08 ? 4 . 8
max . 0 . 05 ? 2 . 6
max . 0 . 10 ? 1 . 5
max . 0 . 06 ? 1 . 29
max . 0 . 07 ? 0 . 45
max . measuring equipment vo a c- 7412 made by iwasaki tsushinki vo a c- 7512 made by iwasaki tsushinki 8 } self resonance frequency srf ?? 17 ? 25 mhz min. 24 ? 235 mhz min. ?? 40 ? 180 mhz min. 9 ? 260 mhz min. 13 ? 320 mhz min. 900 ? 10000 mhz min. 400 ? 10000 mhz min. 300 ? 10000 mhz min. 200 ? 4000 mhz min. 1900 ? 10000 mh i min. 2300 ? 10000 mhz min. lk series me a suring equipment hp 4 195 a measuring jig 41951 16092 a yyyyy or its equivalent hk , h kq, aq series me a suring equipment hp 8 719 c hp 8753 d hk 2125 9 . temperature characteristic ?? ?? inductance change wi t hin ? 10 ? hk, hkq, aq series tem perature range 30 to 85 ? r ef erence temperature 20 ? 10 . resistance to flexure of substrate no mechanical damage. warp 2 mm testing board glass epoxy-resin substrate thickness 0 . 8 mm
ferrite products 5 251 ? pt ???] ?; w m tx ? pt
a ? t b?s ? ? ? ? cs ? ?xi^m { ? please read the "notice for taiyo yuden products" before using this catalog. reliability data 3/4 (note 1 ) when there are questions concerning mesurement result ? measurement shall be made after 48 ? 2 hrs of recovery under the standard condition. multilayer chip inductors and beads item speci?ed value test methods and remarks bk 0603 bk 1005 bk 1608 bk 2125 array bkp 0603 bkp 1005 bkp 1608 bkp 2125 ck 1608 ck 2125 ckp 2520 lk 1005 lk 1608 lk 2125 hk 0603 hk 1005 hk 1608 hk 2125 hkq 0603 s aq 105 bk 2010 bk 3216 11 } solderability at least 75 ? of terminal electrode is covered by new solder. at least 75 ? of terminal electrode is covered by new solder. solder temperature 230 ? 5 ? dur ation 4 ? 1 sec. 12 } resistance to soldering appearance no signi?cant abnormality. imp edance change within ? 30 ? no mechanical damage. rem aining terminal electrode 70 ? min. inductance change ' 10 ? 4 ' 7 within ? 10 ? 6 ' 8 ? 100 within ? 15 ? % 2 520 within ? 30 ? no mechanical damage. remaining terminal electrode 70 ? min. inductance change within ? 15 ? no mechanical damage. rem aining terminal electrode 70 ? min. inductance change 47 # ? 4 ' 7 within ? 10 ? 5 ' 6 ? 330 within ? 15 ? no mechanical damage. remaining terminal electrode 70 ? min. inductance change wit hin ? 5 ? solder temperature 260 ? 5 ? d u r ation 10 ? 0 . 5 sec. pr e heating temperature 150 to 180 ? pr e heating time 3 min. flux immersion into methanol solution with colophony for 3 to 5 sec. recovery 2 to 3 hrs of recovery under the standard condition after the test. see note 1 13 } thermal shock appearance no signi?cant abnormality. imp edance change within ? 30 ? no mechanical damage. in d uctance change within ?? qchange within ?? no mechanical damage. in d uc- ta n ce change wi t hin ? 30 ? no mechanical damage. in d uctance change within ? 10 ? qc h ange within ? 30 ? no mechanical damage. in d uctance change within ? ? qc h ange within ?? conditions for 1 cycle step 1 minimum operating temperature 0 3 ?y 30 ? 3 m in. s te p 2 room temperature 2 to 3 min. st e p 3 maximum operating temperature 0 3 ?y 30 ? 3 m in. s te p 4 room temperature 2 to 3 min. nu m ber of cycles 5 re c overy 2 to 3 hrs of recovery under the standard condition after the test. see note 1
ferrite products 5 253 ? pt ???] ?; w m tx ? pt
a ? t b?s ? ? ? ? cs ? ?xi^m { ? please read the "notice for taiyo yuden products" before using this catalog. reliability data 4/4 multilayer chip inductors and beads note on standard condition: "standard condition" referred to herein is de?ned as follows: 5 to 35? of temperature, 45 to 85 % relative humidity, and 86 to 106 kpa of air pressure. when there are questions concerning measurement results: in order to provide correlation data, the test shall be conducted under condition of 20 ? 2? of temperature, 60 to 70 % relative hu- midity, and 86 to 106 kpa of air pressure. unless otherwise speci?ed, all the tests are conducted under the "standard condition." (note 1) measurement shall be made after 48 ? 2 hrs of recovery under the standard condition. item speci?ed value test methods and remarks bk 0603 bk 1005 bk 1608 bk 2125 array bkp 0603 bkp 1005 bkp 1608 bkp 2125 ck 1608 ck 2125 ckp 2520 lk 1005 lk 1608 lk 2125 hk 0603 hk 1005 hk 1608 hk 2125 hkq 0603 s aq 105 bk 2010 bk 3216 14 } damp heat steady state appearance no signi?cant abnormality. imp edance change within ? 30 ? no mechanical damage. in d uctance change within ? 20 ? q ch a nge within ? 30 ? no mechanical damage. in d uctance change wi t hin ? 30 ? no mechani- cal d amage. in d uctance change within ? 10 ? q ch a nge wi t hin ? 30 ? no mechanical damage. in d uctance change wi t hin ?? q ch a nge wi t hin ?? no mechanical damage. ind uctance change within ? 10 ? q ch a nge within ? 20 ? bbk series tem perature 40 ? 2 ? hu m idity 90 to 95 ? rh duration 500 24 0 hrs recovery 2 to 3 hrs of recovery under the standard condition after the removal from test chamber. see note 1 l k z ck z ckp z hk z hkq z aq series t em perature 40 ? 2 ? lk z ck z ckpseries 60 ? 2 ? h k z h kq z aq series h um idity 90 to 95 ? rh du r ation 500 ? 12 hrs re c overy 2 to 3 hrs of recovery under the standard condition after the removal from test chamber. see note 1 15 } loading under damp heat appearance no signi?cant abnormality. imp edance change within ? 30 ? no mechanical damage. in d uctance change within ? 20 ? q ch a nge within ? 30 ? no mechanical damage. in d uc- ta n ce change wi t hin ? 30 ? no mechanical damage. induc- tan ce change wi t hin ? 10 ? q ch a nge wi t hin ? 30 ? no mechanical damage. induc- tan ce change 0 . 047 to 12 . 0 h within ? 10 ? 15 . 0 to 33 . 0 h wi t hin ? 15 ? q change wi t hin ?? no mechanical damage. in d uc- ta n ce change wi t hin ? 20 ? q ch a nge wi t hin ?? no mechanical damage. ind uctance change within ? 10 ? q ch a nge within ? 20 ? bk series tem perature 40 ? 2 ? hu m idity 90 to 95 ? rh du r ation 500 24 0 hrs rec overy 2 to 3 hrs of recovery under the standard condition after the removal from test chamber. see note 1 lk z ck z ckp z hk z hkq z aq series t em perature 40 ? 2 ? lk z ck z ckpseries 60 ? 2 ? h k z h kq z aq series h um idity 90 to 95 ? rh du r ation 500 ? 12 hrs re c overy 2 to 3 hrs of recovery under the standard condition after the removal from test chamber. see note 1 16 } loading at high temperature appearance no signi?cant abnormality. imp edance change within ? 30 ? no mechanical damage. in d uctance change within ? 20 ? q ch a nge within ? 30 ? no mechanical damage. in d uc- ta n ce change wi t hin ? 30 ? no mechanical damage. induc- tan ce change wi t hin ? 10 ? q ch a nge wi t hin ? 30 ? no mechanical damage. induc- tan ce change 0 . 047 to 12 . 0 h within ? 10 ? 15 . 0 to 33 . 0 h wi t hin ? 15 ? q change wi t hin ? 30 ? no mechanical damage. in d uc- ta n ce change wi t hin ? 20 ? q ch a nge wi t hin ? 30 ? no mechanical damage. ind uctance change within ? 10 ? q ch a nge within ? 20 ? bk series tem perature 125 ? 3 ? ap p lied current rated current duration 500 24 0 hrs r e c overy 2 to 3 hrs of recovery under the standard condition after the removal from test chamber. see note 1 lk z ck z ckp z hk z hkq z aq series z bk series p t y pe te m perature 85 ? 2 ? lk z ck z ckpseries 85 ? 3 ? b k s eries p type 85 ? 2 ? h k 1 608 | 2125 ) 85 ? 2 ? h k 1 005 , aq 105 operating temperature range - 55 to + 85 ? 125 ? 2 ? hk 0603 | hk 1005 , hkq 0603 s | aq 105 operating temperature range - 55 to + 125 ? applied current rated current dur ation 500 ? 12 hrs re c overy 2 to 3 hrs of recovery under the standard condition after the test. see note 1
precautions ferrite products 5 255 ? pt ???] ?; w m tx ? pt
a ? t b?s ? ? ? ? cs ? ?xi^m { ? please read the "notice for taiyo yuden products" before using this catalog. type 1608 2125 3216 l 1.6 2.0 3.2 w 0.8 1.25 1.6 a 0.8?1.0 1.0?1.4 1.8?2.5 b 0.5?0.8 0.8?1.5 0.8?1.7 c 0.6?0.8 0.9?1.2 1.2?1.6 1/7 precautions on the use of multilayer chip inductors, multilayer chip inductors for high frequency, multilayer ferrite chip beads 1 . circuit design veri?cation of operating environment, electrical rating and performance 1 . a malfunction in medical equipment, spacecraft, nucle- ar r eactors, etc. may cause serious harm to human life or have sever e social rami?cations. as such, any inductors to be used in such equipment may r equire higher safety and/or reliability considerations and should be clearly differentiated from components used in general purpose applications. operating current veri?cation of rated current 1 . the operating current for inductors must always be lower than their rated values. 2 . do not apply current in excess of the rated value because the inductance may be r educed due to the magnetic saturation effect. technical considerations stages precautions 2. pcb design pattern con?gurations design of land-patterns 1 . when inductors are mounted on a pcb, the size of land patterns and the amount of solder used size of fillet can directly affect inductor performance. therefore, the following items must be carefully con- sider ed in the design of solder land patter ns: 1 the amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or cracking. therefore, when designing land-patterns it is necessary to consider the appropriate size and con?guration of the solder pads which in turn determines the amount of solder necessary to form the ?llets. 2 when more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's soldering point is separated by solder-resist. 3 the larger size of land patterns and amount of solder, the smaller q value after mounting on pcb. it makes higher the q value to design land patterns smaller than terminal electrode of chips. 1 . the following diagrams and tables show some examples of recommended patterns to prevent excessive solder amounts larger ?llets which extend above the component end terminations . examples of improper pattern designs are also shown. 1 recommended land dimensions for a typical chip inductor land patterns for pcbs recommended land dimensions for re?ow-soldering unit: mm size excess solder can affect the ability of chips to withstand mechanical stresses. therefore, please take proper precautions when designing land-patterns. recommended land dimensions for wave-soldering unit: mm recommended land dimension for re?ow-soldering unit: mm 3216 2010 l 3.2 2.0 w 1.6 1.0 a 0.7 ? 0.9 0.5 ? 0.6 b 0.8 ? 1.0 0.5 ? 0.6 c 0.4 ? 0.5 0.2 ? 0.3 d 0.8 0.5 size size type 0603 1005 105 1608 2125 3216 2520 l 0.6 1.0 1.0 1.6 2.0 3.2 2.5 w 0.3 0.5 0.6 0.8 1.25 1.6 2.0 a 0.20?0.30 0.45?0.55 0.50?0.55 0.6?0.8 0.8?1.2 1.8?2.5 1.0?1.4 b 0.20?0.30 0.40?0.50 0.30?0.40 0.6?0.8 0.8?1.2 0.6?1.5 0.6?1.0 c 0.25?0.40 0.45?0.55 0.60?0.70 0.6?0.8 0.9?1.6 1.2?2.0 1.8?2.2
precautions ferrite products 5 257 ? pt ???] ?; w m tx ? pt
a ? t b?s ? ? ? ? cs ? ?xi^m { ? please read the "notice for taiyo yuden products" before using this catalog. 2 examples of good and bad solder application not recommended recommended 2.pcb design not recommended recommended de?ection of the board mixed mount- ing of smd and leaded compo- nents c o m p o n e n t placement close to the chassis h an d-soldering o f l e a d e d c o m p o n e n t s near mounted components horizontal com- pon ent place- ment pattern con?gurations inductor layout on panelized | breakaway pc boards 1 . after inductors have been mounted on the boards, chips can be subjected to mechanical stresses in sub- s e q uent manufacturing processes pcb cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering the re?ow soldered boards etc. for this reason, planning pattern con?gurations and the position of smd inductors should be carefully performed to minimize stress. 1-1 . the following are examples of good and bad inductor layout; smd induc- tors should be located to minimize any possible mechanical stresses from board warp or de?ection. item 1-2 . to layout the inductors for the breakaway pc board, it should be noted that the amount of mechanical stresses given will vary depending on in- ductor layout. an example below should be counted for better design. 1-3 . when breaking pc boards along their perforations, the amount of me- chanical stress on the inductors can vary according to the method used. the following methods are listed in order from least stressful to most stressful: push-back, slit, v-grooving, and perforation. thus, any ideal smd inductor layout must also consider the pcb splitting procedure. 2/7 stages precautions technical considerations precautions on the use of multilayer chip inductors, multilayer chip inductors for high frequency, multilayer ferrite chip beads
precautions ferrite products 5 259 ? pt ???] ?; w m tx ? pt
a ? t b?s ? ? ? ? cs ? ?xi^m { ? please read the "notice for taiyo yuden products" before using this catalog. 3 / 7 technical considerations stages precautions 1 . if the lower limit of the pick-up nozzle is low, too much force may be imposed on the inductors, causing damage. to avoid this, the following points should be considered before lowering the pick-up nozzle: 1 the lower limit of the pick-up nozzle should be adjusted to the surface level of the pc board after correcting for de?ection of the board. 2 the pick-up pressure should be adjusted between 1 and 3 n static loads. 3 to reduce the amount of de?ection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins should be used under the pc board. the following diagrams show some typical examples of good pick-up nozzle placement: improper method proper method 2 . as the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the inductors because of mechanical im- p a c t on the inductors. to avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance, inspection and replacement of the pin should be conducted periodically. se l ection of adhesives 1 . mounting inductors with adhesives in preliminary assembly, before the soldering stage, may lead to degraded inductor characteristics unless the following factors are appropriately checked; the size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. therefore, it is imperative to consult the manufacturer of the adhesives on proper usage and amounts of adhesive to use. 1 . some adhesives may cause reduced insulation resistance. the differ- e nc e between the shrinkage percentage of the adhesive and that of the inductors may result in stresses on the inductors and lead to cracking. moreover, too little or too much adhesive applied to the board may ad- v e r sely affect component placement, so the following precautions should be noted in the application of adhesives. 1 required adhesive characteristics a. the adhesive should be strong enough to hold parts on the board during the mounting & solder process. b. the adhesive should have suf?cient strength at high temperatures. c. the adhesive should have good coating and thickness consistency. d. the adhesive should be used during its prescribed shelf life. e. the adhesive should harden rapidly f. the adhesive must not be contaminated. g. the adhesive should have excellent insulation characteristics. h. the adhesive should not be toxic and have no emission of toxic gasses. 3 .considerations for automatic placement adjustment of mounting machine 1 . excessive impact load should not be imposed on the inductors when mounting onto the pc boards. 2 . the maintenance and inspection of the mounter should be conducted periodically. double-sided mounting single-sided mounting precautions on the use of multilayer chip inductors, multilayer chip inductors for high frequency, multilayer ferrite chip beads
precautions ferrite products 5 261 ? pt ???] ?; w m tx ? pt
a ? t b?s ? ? ? ? cs ? ?xi^m { ? please read the "notice for taiyo yuden products" before using this catalog. 3 .considerations for aut omatic placement 4 .soldering selection of flux 1 . since ?ux may have a signi?cant effect on the perfor- ma n ce of inductors, it is necessary to verify the follow- i n g conditions prior to use; 1 flux used should be with less than or equal to 0 . 1 wt% chlorine conversion method of halogenated content. flux having a strong acidity content should not be applied. 2 when soldering inductors on the board, the amount of flux applied should be controlled at the optimum level. 3 when using water-soluble ?ux, special care should be taken to properly clean the boards. soldering temperature, time, amount of solder, etc. are speci?ed in accordance with the following recommended conditions. 1 - 1 . when too much halogenated substance chlorine, etc. content is used to activate the ?ux, or highly acidic ?ux is used, an excessive amount of residue after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the surface of the inductor. 1 - 2 . flux is used to increase solderability in ?ow soldering, but if too much is applied, a large amount of ?ux gas may be emitted and may detrimentally affect solderability. to minimize the amount of ?ux applied, it is recom- m e n ded to use a ?ux-bubbling system. 1 - 3 . since the residue of water-soluble ?ux is easily dissolved by water content in the air, the residue on the surface of inductor in high humidity conditions may cause a degradation of insulation resistance and therefore affect the reliability of the components. the cleaning methods and the capability of the machines used should also be considered carefully when selecting water- soluble ?ux. 1 - 1 . preheating when soldering heating: chip inductor components should be preheated to within 100 to 130 ? of the soldering. cooling: the temperature difference between the components and cleaning process should not be greater than 100 ? . chip inductors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. therefore, the soldering process must be conducted with a great care so as to prevent malfunction of the components due to excessive thermal shock. technical considerations stages precaution 4 / 7 figure 0805 case sizes as examples a 0 . 3 mm min b 100 ? 120 m c area with no adhesive when using adhesives to mount inductors on a pcb, inappropriate amounts of adhesive on the board may adversely affect component placement. too little adhesive may cause the inductors to fall off the board during the solder process. too much adhesive may cause defective soldering due excessive ?ow of adhe- s i v e on to the land or solder pad. | recommended conditions precautions on the use of multilayer chip inductors, multilayer chip inductors for high frequency, multilayer ferrite chip beads
precautions ferrite products 5 263 ? pt ???] ?; w m tx ? pt
a ? t b?s ? ? ? ? cs ? ?xi^m { ? please read the "notice for taiyo yuden products" before using this catalog. 5 / 7 stages precautions technical considerations 4 .soldering recommended conditions for soldering | re?ow soldering temperature pro?le 2 . because excessive dwell times can detrimentally affect solderability, soldering duration should be kept as close to recommended times as possible. | wave soldering temperature pro?le caution 1 . the ideal condition is to have solder mass ?llet controlled to 1 / 2 to 1 / 3 of the thickness of the inductor, as shown below: caution 1 . make sure the inductors are preheated suf?ciently. 2 . the temperature difference between the inductor and melted solder should not be greater than 100 to 130 ? 3 . cooling after soldering should be as gradual as possible. 4 . wave soldering must not be applied to the inductors designated as for re- ? o w soldering only. | hand soldering temperature pro?le caution 1 . use a 20 w soldering iron with a maximum tip diameter of 1 . 0 mm. 2 . the soldering iron should not directly touch the inductor. cleaning conditions 1 . when cleaning the pc board after the inductors are all mounted, select the appropriate cleaning solu- t i o n according to the type of flux used and pur- po s e of the cleaning e.g. to remove soldering ?ux or other materials from the production process. 1 . the use of inappropriate solutions can cause foreign substances such as ?ux residue to adhere to the inductor, resulting in a degradation of the inductor's electrical properties especially insulation resistance . 5 .cleaning precautions on the use of multilayer chip inductors, multilayer chip inductors for high frequency, multilayer ferrite chip beads and please contact us about peak temperature when you use lead-free paste. e?? 260 ??< 10 | e?? 260 ??< 10 | '?150? 60 ? 350 ??< 3 | 120 ? 60 ? '?150? ?c?230 ?? 40 | t?? qx?i9sqw)u 100 ? ??:x s|w- aqs?? b{ t?? qx?i9sqw)u ? ??:x s|w- aqs?? b{ t?? ??7??ax ?v?b{ t?)? 190 ? 3216 ????zu 1 ?* ??`?b{ t a
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* ?b??wpx]_m?d?{ 9s? 300 200 100 0 9s? 300 200 100 0 9s? 400 300 200 100 0 ?? ?? ?? peak 260? max 10 sec max pb free soldering pb free soldering pb free soldering peak 260? max 10 sec max t ceramic chip components should be preheated to within 100 to 130? of the soldering. t assured to be reflow soldering for 2 times. t ceramic chip components should be preheated to within 100 to 130? of the soldering. t assured to be wave soldering for 1 time. t except for reflow soldering type. t?) t190? 3216type max , ?)? 130? 3225 type ming t it is recommended to use 20w soldering iron and the tip is 1 or less. t the soldering iron should not directly touch the components. t assured to be soldering iron for 1 time. note: the above profiles are the maximum allowable soldering condition, therefore these profiles are not always recommended. temperature ? 300 200 100 0 t emperatur e ? 300 200 100 0 t emperatur e ? 400 300 200 100 0 preheating 150? 60 sec min gradually cooling gradually cooling gradually cooling heating above 230? 40 sec max preheating 150? 120 sec min 350? max 3 sec max 60 sec min ?) ?) e?? 260 ??< 10 | e?? 260 ??< 10 | '?150? 60 ? 350 ??< 3 | 120 ? 60 ? '?150? ?c?230 ?? 40 | t?? qx?i9sqw)u 100 ? ??:x s|w- aqs?? b{ t?? qx?i9sqw)u ? ??:x s|w- aqs?? b{ t?? ??7??ax ?v?b{ t?)? 190 ? 3216 ????zu 1 ?* ??`?b{ t a
?u??t
? ??sm?ot]y?<^m{ ts
:x 1 s|w- aqs?? b{ ? g9s????x7g?0 epk? z yy t\??
* ?b??wpx]_m?d?{ 9s? 300 200 100 0 9s? 300 200 100 0 9s? 400 300 200 100 0 ?? ?? ?? peak 260? max 10 sec max pb free soldering pb free soldering pb free soldering peak 260? max 10 sec max t ceramic chip components should be preheated to within 100 to 130? of the soldering. t assured to be reflow soldering for 2 times. t ceramic chip components should be preheated to within 100 to 130? of the soldering. t assured to be wave soldering for 1 time. t except for reflow soldering type. t?) t190? 3216type max , ?)? 130? 3225 type ming t it is recommended to use 20w soldering iron and the tip is 1 or less. t the soldering iron should not directly touch the components. t assured to be soldering iron for 1 time. note: the above profiles are the maximum allowable soldering condition, therefore these profiles are not always recommended. temperature ? 300 200 100 0 t emperatur e ? 300 200 100 0 t emperatur e ? 400 300 200 100 0 preheating 150? 60 sec min gradually cooling gradually cooling gradually cooling heating above 230? 40 sec max preheating 150? 120 sec min 350? max 3 sec max 60 sec min ?) ?) e?? 260 ??< 10 | e?? 260 ??< 10 | '?150? 60 ? 350 ??< 3 | 120 ? 60 ? '?150? ?c?230 ?? 40 | t?? qx?i9sqw)u 100 ? ??:x s|w- aqs?? b{ t?? qx?i9sqw)u ? ??:x s|w- aqs?? b{ t?? ??7??ax ?v?b{ t?)? 190 ? 3216 ????zu 1 ?* ??`?b{ t a
?u??t
? ??sm?ot]y?<^m{ ts
:x 1 s|w- aqs?? b{ ? g9s????x7g?0 epk? z yy t\??
* ?b??wpx]_m?d?{ 9s? 300 200 100 0 9s? 300 200 100 0 9s? 400 300 200 100 0 ?? ?? ?? peak 260? max 10 sec max pb free soldering pb free soldering pb free soldering peak 260? max 10 sec max t ceramic chip components should be preheated to within 100 to 130? of the soldering. t assured to be reflow soldering for 2 times. t ceramic chip components should be preheated to within 100 to 130? of the soldering. t assured to be wave soldering for 1 time. t except for reflow soldering type. t?) t190? 3216type max , ?)? 130? 3225 type ming t it is recommended to use 20w soldering iron and the tip is 1 or less. t the soldering iron should not directly touch the components. t assured to be soldering iron for 1 time. note: the above profiles are the maximum allowable soldering condition, therefore these profiles are not always recommended. temperature ? 300 200 100 0 t emperatur e ? 300 200 100 0 t emperatur e ? 400 300 200 100 0 preheating 150? 60 sec min gradually cooling gradually cooling gradually cooling heating above 230? 40 sec max preheating 150? 120 sec min 350? max 3 sec max 60 sec min ?) ?)
precautions ferrite products 5 265 ? pt ???] ?; w m tx ? pt
a ? t b?s ? ? ? ? cs ? ?xi^m { ? please read the "notice for taiyo yuden products" before using this catalog. technical considerations stages precautions 6 / 7 2 . cleaning conditions should be determined after verifying, through a test run, that the cleaning pro- ce s s does not affect the inductor's characteristics. 2 . inappropriate cleaning conditions insuf?cient or excessive cleaning may detrimentally affect the performance of the inductors. 1 excessive cleaning in the case of ultrasonic cleaning, too much power output can cause excessive vibration of the pc board which may lead to the cracking of the inductor or the soldered portion, or decrease the terminal electrodes' strength. thus the following conditions should be carefully checked; u l t rasonic output below 20 w/ y ultrasonic frequency below 40 khz ultrasonic washing period 5 min. or less 5 .cleaning 7 . handling breakaway pc boards splitting along perforations 1 . when splitting the pc board after mounting inductors and other components, care is required so as not to give any stresses of de?ection or twisting to the board. 2 . board separation should not be done manually, but by using the appropriate devices. general handling precautions 1 . always wear static control bands to protect against esd. 2 . keep the inductors away from all magnets and mag- n e t ic objects. 3 . use non-magnetic tweezers when handling inductors. 4 . any devices used with the inductors soldering irons, measuring instruments should be properly grounded. 5 . keep bare hands and metal products i.e., metal desk away from chip electrodes or conductive areas that lead to chip electrodes. 6 . keep inductors away from items that generate mag- n et ic ?elds such as speakers or coils. mechanical considerations 1 . be careful not to subject the inductors to excessive mechanical shocks. 1 if inductors are dropped on the ?oor or a hard surface they should not be used. 2 when handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other boards or components. application of resin coatings, moldings, etc. to the pcb and components. 1 . with some type of resins a decomposition gas or chemical reaction vapor may remain inside the res- in d uring the hardening period or while left under normal storage conditions resulting in the deterio- r at ion of the inductor's performance. 2 . when a resin's hardening temperature is higher than the inductor's operating temperature, the stresses generated by the excess heat may lead to inductor damage or destruction. 3 . stress caused by a resin ? s temperature generated expansion and contraction may damage inductors. the use of such resins, molding materials etc. is not recommended. 6 . post cleaning processes precautions on the use of multilayer chip inductors, multilayer chip inductors for high frequency, multilayer ferrite chip beads
precautions ferrite products 5 267 ? pt ???] ?; w m tx ? pt
a ? t b?s ? ? ? ? cs ? ?xi^m { ? please read the "notice for taiyo yuden products" before using this catalog. 7 / 7 8 . storage conditions 1 . if the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and deterioration of taping/packaging materials may take place. for this reason, components should be used within 6 months from the time of delivery. if exceeding the above period, please check solder- a bi lity before using the inductors storage 1 . to maintain the solderability of terminal electrodes and to keep the packaging material in good condi- t io n, care must be taken to control temperature and humidity in the storage area. humidity should especially be kept as low as possible. recommended conditions ambient temperature below 40 ? humidity below 70 % rh the ambient temperature must be kept below 30 ? . even under ideal storage conditions inductor electrode solderability decreases as time passes, so inductors should be used within 6 months from the time of delivery. *the packaging material should be kept where no chlorine or sulfur exists in the air. technical considerations stages precautions precautions on the use of multilayer chip inductors, multilayer chip inductors for high frequency, multilayer ferrite chip beads

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